Dutch maker of the machines that assemble and package chips, with hybrid bonding — the process that stacks dies in the advanced packages AI accelerators and HBM memory rely on — as its key product. Sells to chipmakers and packaging houses.
Dutch maker of the machines that assemble and package chips, with hybrid bonding — the process that stacks dies in the advanced packages AI accelerators and HBM memory rely on — as its key product. Sells to chipmakers and packaging houses.